On 2020 February 8th, JCET Group Co., Ltd. donated 5 million CNY via the Jiangyin Charity Federation, to support the prevention of NCP (Novel coronavirus pneumonia）. The donation included 4 million CNY to support epidemic prevention and control, patient t
In response to the current coronavirus epidemic, JCET Group Co., Ltd. has responded quickly to incorporate the relevant regulations at the national, provincial, municipal and high-tech government levels and has quickly established the Emergency Command Co
As we move closer to integrate our subsidiaries, STATS ChipPAC, JCET and JCAP collectively under JCET Group Co., Ltd., it is our intention to establish a single electronic identity.
Singapore – December 24, 2019 – JCET Group Co., Ltd (‘JCET’) has entered into a strategic business agreement with Analog Devices Inc. (‘ADI’) in which JCET will acquire ADI’s test facility in Singapore. As part of this agreement, JCET will take on additio
Jiangyin, November 18, 2019 - JCET announced it has received Shareholder approval to change its English name from Jiangsu Changjiang Electronics Technology Co., Ltd. and Jiangsu Changdian Technology Co., Ltd. to JCET Group Co., Ltd. Founded in 1972, JCET
JCET Group, (SH:600584), the largest OSAT (Outsourced Semiconductor Assembly and Test) services provider in mainland China and the third largest in the world, announced financial results for the third quarter ended September 30, 2019 on October 29, 2019.
JCET Group Co., Ltd (‘JCET Group’) today announced a new senior management appointment. Approved by the board of directors, Ms. Janet Tao Chou was appointed Chief Financial Officer, replacing Mr. Mu Haoping. Mr. Mu will now serve as Senior Vice President
JIANGYIN, September 9, 2019 /PRNewswire/ -- Jiangsu Changjiang Electronics Technology Co., Ltd (‘JCET’) today announces the appointment of Zheng Li as Chief Executive Officer and nominates as Director, replacing Dr. Choon Heung Lee, who will continue to s
Incheon, South Korea – July 29, 2019 – Jiangsu Changjiang Electronics Technology Co., Ltd (‘JCET’) has moved into volume production with its new 12 inch wafer bumping line which is located in Class 100 and Class 1000 clean room space in its state of the a
Singapore – 2 May 2018 – STATS ChipPAC Pte. Ltd. , a leading provider of advanced semiconductor packaging and test services, announced today the expanded qualification of its embedded Wafer Level Ball Grid Array (eWLB) technology for Grades 1 and 2 of the