新疆25选7开奖2019年:中文

新疆35选7福利彩票双色球开奖结果 www.fwxjht.com.cn

Full Turnkey Service

Advanced package & silicon co-design process achieves optimum solution at a lower cost

Wafer Bump
Experienced in a? wide range of wafer bump alloys and processes – Electroplated process for SnPb, Pb-free, and Cu pillar bumps
Full service wafer bumping with Polyimide/PBO dielectric options for wafer repassivation and redistribution layer (RDL)
Fine pitch bumps down to 0.35mm (array and peripheral)
Contact Us |  Customer |  Legal