新疆35选7福利彩票双色球开奖结果 www.fwxjht.com.cn

Full Turnkey Service

Advanced package & silicon co-design process achieves optimum solution at a lower cost

Assembly
Comprehensive assembly services for discrete, wirebond and flip chip packages to advanced wafer level packaging (WLP), Package-on-Package (PoP) and System-in-Package (SiP) solutions
Advanced substrates, enhanced molding processes, high density SMT, and electromagnetic interference (EMI) shielding for SiP solutions
Significant manufacturing scale in China, South Korea and Singapore
Contact Us |  Customer |  Legal

Contact Us Customer Enquiry Legal

Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd 蘇ICP備05082751號32028102000607

Copyright @ Jiangsu Changjiang Electronics Technology Co., Ltd
新疆35选7福利彩票双色球开奖结果 32028102000607

Official Accounts of JCET